About

Behind This

C o n c e p t

Highly Trained And Multiple Certified.

As the nature of

soldered connections

poses a permanent

challenge    for

electronics production,

it is immanent

the operator's line

of action to ally

theory and experience. 

As a PCB-Assembly-Operator and on the basis of construction trade L. Skoda converted the causation of shrinkage cracks to also explain the various types of disturbances within solder joints.

 

The unequal heat dissipation of a solder joint appears analogous to premature and unbalanced evaporation of water causing volume shrinkage and anomalies within the material.

 

Handling the very high requirements for aviation- and space electronics and multiple certified, Skoda published empirical studies as well as  technical papers and developed a novel system and soldering technique.

With his subject Skoda is also represented as an independent speaker at various specialist conferences among the German DVS/GMM, IMAPS-Germany, ESA-ESTEC and others.

 

With the Convergence Pad as a PCB Layout-conception, Skoda himself registered for a patent and provides a highly efficient and innovative solution for any production appliance.


Furthermore, the working principle therein opens up new approaches to process engineering for reflow and wave soldering processes.

L.SKODA

Deviser, Author, Petitioner, Operator.

" I'm always interested in challenges and to bring progressive acquirements to your enterprise." (L. Skoda)

Certifications

Manual soldering of high-reliability electrical connections.


High-reliability soldering for surface-mount and mixed technology.



Repair and modification of printed circuit board assemblies for space use.


Patent Registration        General Issues

The Subject


A solder pad (THT / SMT), including one web-like expansion.

The Proceeding


Drive off a directed heat source via the web-like expansion.

Registration Date:      2019-11-26

Disclosure:                     2021-05-27

Status:                             Pending

File Number:                 DE 10 2019 131 950.1

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